Valens partnered with onsemi to integrate A-PHY connectivity into image sensors.
Third-quarter revenue reached $21.9 million, topping company guidance.
Valens expanded from silicon sales into manufacturing finished connectivity systems.
On its third quarter of 2026 earnings call, held on Nov. 11, 2026, Valens Semiconductor (NYSE:VLN) announced quarterly revenue of $21.9 million, topping management's outlook. The chipmaker is shifting its core business strategy from selling high-end specialized silicon toward capturing higher-volume mainstream markets. Three takeaways from the call highlight how this strategic pivot alters the company's long-term thesis.
The company historically targeted niche, high-performance audio-video installations with premium connectivity chips. To accelerate growth, management launched the VS6310 semiconductor chip designed for lower power consumption, allowing direct integration into standard video conferencing equipment.
Historically, we've been a premium-only company focused on high-performance applications. Going forward, we're going to build on the foundation while expanding into mainstream higher-volume markets.
-- Yoram Salinger, Chief Executive Officer
In automotive connectivity, high costs limited adoption of the company's MIPI A-PHY standard, an industry specification for vehicle sensor data, to luxury vehicles. A collaboration with onsemi, a semiconductor manufacturing partner, integrates connectivity directly into 3-megapixel image sensors, removing stand-alone serializer chips to reduce overall component costs for mass-market vehicles.
By eliminating the need for a separate serializer, we can reduce component count, simplify camera design and importantly, lower the overall costs.
-- Yoram Salinger, Chief Executive Officer
Valens previously captured revenue solely from selling individual silicon chips to device manufacturers. By leveraging Acroname, its hardware engineering subsidiary acquired in 2024, the business is assembling complete active cables and extension boxes to capture higher sales value across the supply chain.
By selling finished products, we can capture significantly more value from our technology.
-- Yoram Salinger, Chief Executive Officer
Automotive shipments to Mercedes-Benz are expanding, and the company is tracking toward the upper boundary of its annual sales target. Integrating semiconductor designs directly with key manufacturing partners reinforces structural switching costs across broader volume markets.
We are reaffirming our previously announced guidance for the full year 2026 to be between $78 million to $81 million toward the upper end of the range.
-- Karine Pinto-Flomenboim, Chief Financial Officer
Expanding into mainstream categories broadens market scale while custom software layers increase customer retention. Scaling system-level products secures long-term growth across both core segments.
This strategic direction will unlock new business opportunities, attract new customers and drive sustainable growth.
-- Yoram Salinger, Chief Executive Officer
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