Some investors asked Shennan Circuit. Hello, has the company's FC-BGA packaging substrates been shipped in batches? On November 3, the company answered on the interactive platform that the company's FC-BGA packaging substrates already have mass production capacity for products with 26 layers and below, and that technology development and proofing work for products with 30 layers and above is progressing as scheduled.

Zhitongcaijing · 3d ago
Some investors asked Shennan Circuit. Hello, has the company's FC-BGA packaging substrates been shipped in batches? On November 3, the company answered on the interactive platform that the company's FC-BGA packaging substrates already have mass production capacity for products with 26 layers and below, and that technology development and proofing work for products with 30 layers and above is progressing as scheduled.