Nvidia recently publicly demonstrated the next generation of co-packaged optical technology called OOI at SEMICON West 2026. Unlike existing CPO solutions, OOI chose to take the organic packaging board and directly integrate the optical engine onto the silicon intermediate layer carrying the GPU, bringing the optoelectronic conversion process closer to the chip core, and providing a new interconnection idea for the next generation of hyperscale AI clusters. According to Nikola Nedovich, chief research scientist at the Nvidia Research Institute, the plan replaces the current organic packaging board with a larger intermediate layer. Currently, Nvidia has obtained prototype samples.

Nvidia recently publicly demonstrated the next generation of co-packaged optical technology called OOI at SEMICON West 2026. Unlike existing CPO solutions, OOI chose to take the organic packaging board and directly integrate the optical engine onto the silicon intermediate layer carrying the GPU, bringing the optoelectronic conversion process closer to the chip core, and providing a new interconnection idea for the next generation of hyperscale AI clusters. According to Nikola Nedovich, chief research scientist at the Nvidia Research Institute, the plan replaces the current organic packaging board with a larger intermediate layer. Currently, Nvidia has obtained prototype samples.