Recently, semiconductor bonding integration company Qinghe Jingyuan announced the completion of a pre-IPO round of financing. This round of financing was jointly invested by Wei Hao Chuangxin and a number of core semiconductor industry players such as Shanghai Xiangju Investment, Xiamen Jingyao, Xinlian Integration, and the Sichuan Development Science and Technology Innovation Fund, as well as old shareholders such as Zhongwei Company, Tongchuang Weiye, XinkineEnergy, Yunhui Capital, Sinke Parent Fund, and Sinke Industrial Investment. Qinghe Jingyuan technology and products are widely used in cutting-edge fields such as HBM high-bandwidth storage, 2.5D/3D advanced packaging, sensing, optical communication, and heterogeneous integration of wafer-level materials.

Recently, semiconductor bonding integration company Qinghe Jingyuan announced the completion of a pre-IPO round of financing. This round of financing was jointly invested by Wei Hao Chuangxin and a number of core semiconductor industry players such as Shanghai Xiangju Investment, Xiamen Jingyao, Xinlian Integration, and the Sichuan Development Science and Technology Innovation Fund, as well as old shareholders such as Zhongwei Company, Tongchuang Weiye, XinkineEnergy, Yunhui Capital, Sinke Parent Fund, and Sinke Industrial Investment. Qinghe Jingyuan technology and products are widely used in cutting-edge fields such as HBM high-bandwidth storage, 2.5D/3D advanced packaging, sensing, optical communication, and heterogeneous integration of wafer-level materials.