ACM Research, Inc. develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, polishing and thermal processes that are critical to advanced semiconductor device manufacturing, as well as wafer-level packaging. The Company offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of 2D and 3D wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The Company also develops, manufactures and sells a range of advanced packaging tools to wafer assembly and packaging customers.