MARKET

ASYS

ASYS

Amtech Systems
NASDAQ
5.41
+0.08
+1.50%
After Hours: 5.50 +0.09 +1.66% 19:02 03/28 EDT
OPEN
5.27
PREV CLOSE
5.33
HIGH
5.45
LOW
5.22
VOLUME
27.96K
TURNOVER
0
52 WEEK HIGH
11.98
52 WEEK LOW
3.370
MARKET CAP
76.77M
P/E (TTM)
-3.9941
1D
5D
1M
3M
1Y
5Y
Weekly Report: what happened at ASYS last week (0318-0322)?
Weekly Report · 3d ago
Does Amtech Systems (NASDAQ:ASYS) Have A Healthy Balance Sheet?
Amtech Systems, Inc. (NASDAQ:ASYS) has US$10.0m of debt. The company uses debt to fund its operations. Amtech Systems has a negative free cash flow of US$3.7m in the last year. Despite this, the company does not have a heavy debt load. The balance sheet is a good indicator of a company's ability to maintain a healthy balance sheet. We've discovered 3 warning signs for Amtech systems that you should be aware of.
Simply Wall St · 6d ago
Weekly Report: what happened at ASYS last week (0311-0315)?
Weekly Report · 03/18 09:21
Weekly Report: what happened at ASYS last week (0304-0308)?
Weekly Report · 03/11 09:21
Weekly Report: what happened at ASYS last week (0226-0301)?
Weekly Report · 03/04 09:21
Amtech Systems: Current report
Press release · 03/01 06:07
Amtech Systems Revises Executive Compensation Structure
TipRanks · 02/29 21:33
Weekly Report: what happened at ASYS last week (0219-0223)?
Weekly Report · 02/26 09:23
More
About ASYS
Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.

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