News
CYBE
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CyberCatch Announces Sweetwater Union High School District Selects Company's AI-Enabled Continuous Cybersecurity Solution to Enhance Cyber Risk Mitigation
PR Newswire · 05/24/2023 12:00
First U.S. Secretary of Homeland Security and CyberCatch Board Advisor Tom Ridge Delivers Special Message About The Need For Continuous Cyber Risk Mitigation
PR Newswire · 05/18/2023 12:00
CyberCatch Shares Example of Helping Customers Attain Cybersecurity Compliance in Two Weeks or Less Versus Three Months or More with AI-Enabled Solution
PR Newswire · 05/17/2023 12:00
CyberCatch Ranks Among Highest-Scoring Businesses on Inc. Magazine's Annual List of Best Workplaces for 2023
PR Newswire · 05/15/2023 12:00
CyberCatch CEO Interviewed by BNN Bloomberg on Artificial Intelligence and Cybersecurity
PR Newswire · 05/10/2023 12:00
CyberCatch Publishes Complimentary Ransomware Risk Assessment Worksheet and Podcast To Help Organizations Discover Risk Level in 30 Minutes
PR Newswire · 05/04/2023 12:00
CyberCatch announces hiring of Vice President, Head of Global Sales to drive sales growth
PR Newswire · 05/03/2023 12:00
CyberCatch announces Partnership with Canadian SME Magazine to reach 1.2M SMEs in Canada
PR Newswire · 04/26/2023 12:00
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About CYBE
CyberOptics Corporation is a global developer and manufacturer of high precision three-dimensional (3D) sensors and system products for inspection and metrology. The Company develops and manufactures WaferSense products, which is a family of wireless, wafer-shaped sensors that provides measurements of critical factors in the semiconductor fabrication process. Its sensors are used for inspection and metrology in the surface mount technology (SMT) and semiconductor markets. It sells its high precision 3D sensors and system products based on its proprietary Multi-Reflection Suppression (MRS) technology. Its products include SQ3000 and SQ3000+ multi-function systems, micron pixel 3D NanoResolution MRS sensor, WX3000 metrology and MX3000 Automated Optical Inspection (AOI) system. Its MX3000 AOI system for 3D inspection of memory modules following the singulation step of the manufacturing process. It conducts operations through its facilities in North America, Asia and Europe.