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Qorvo Awarded DoD Contract To Advance Copper-Pillar-On-GaN Technology

GREENSBORO, N.C., May 20, 2020 (GLOBE NEWSWIRE) -- Qorvo® (NASDAQ:QRVO), a leading provider of innovative RF solutions that connect the world, has been awarded a three-year contract to further advance the

Benzinga · 05/20/2020 12:13

GREENSBORO, N.C., May 20, 2020 (GLOBE NEWSWIRE) -- Qorvo® (NASDAQ:QRVO), a leading provider of innovative RF solutions that connect the world, has been awarded a three-year contract to further advance the development of copper-pillar-on-GaN flip-chip technology. This Department of Defense (DoD) program will create a high-yield domestic foundry to mature the copper flip assembly process, which enables vertical die stacking in space-constrained phased array radar systems and other defense electronics.