Xinxin's Science and Technology Innovation Board IPO review status changed to “suspended (financial report update)”

The Zhitong Finance App learned that on June 30, Wuhan Xinxin Integrated Circuit Co., Ltd. (“Xinxin” for short) updated the IPO review status of the Shanghai Stock Exchange Science and Technology Innovation Board to “suspended (financial report update)”, according to the Shanghai Stock Exchange website. Cathay Pacific Haitong Securities and Huayuan Securities are their sponsors and plan to raise 4.8 billion yuan.

According to the prospectus, Xinxin Co., Ltd. is a leading semiconductor specialty process foundry company in China. It focuses on business fields such as specialty storage, digital-analog mixing, and 3D integration, and can provide wafer foundry for various semiconductor products based on various technology nodes and different process platforms.

Supported by a characteristic storage business and led by 3D integration technology, Xinxin Co., Ltd. deepens collaboration and continues to iterate technology. It provides foundry products that are widely used in automotive electronics, industrial control, consumer electronics, computers, the Internet of Things, etc., and has formed stable and good cooperative relationships with leading manufacturers in various industry segments, and its revenue is showing an overall growth trend.

In the field of specialty storage, Xinxin Co., Ltd. is the largest NOR Flash manufacturer in mainland China. It has industry-leading code-type flash memory technology, and the manufacturing process covers two mainstream structures: floating gate type and charge capture type. The company's process nodes cover 65nm to 50nm in the floating gate process, where the 50nm technology platform has industry-leading storage density; it is the only global foundry supplier of code-type flash memory (product A) for the customer in terms of charge capture processes.

In the field of digital-analog mixing, the company has the entire CMOS image sensor manufacturing process. It has a BSI process and stacked process that has been produced stably for many years, with a complete technical platform layout and leading technical strength; the company's 12-inch RF-SOI process platform has achieved mass production of 55nm products, leading domestic RF device performance, and is widely used in wireless communication fields such as smartphones.

In the field of 3D integration, the company has internationally leading core technologies such as silicon through-hole and hybrid bonding. The company's application of dual-wafer stacking, multi-wafer stacking, chip-wafer heterogeneous integration, and silicon adapter board technology continues to expand.