On the afternoon of May 9, a roadshow and exchange event was held at the Beijing Financial Assets Exchange. Representatives of the first batch of eight companies that issued science and technology innovation bonds in the interbank bond market appeared one by one. This marks the beginning of the issuance of science and technology innovation bonds, and the official launch of the “technology board” of the bond market. Bao Xiangming, Deputy Secretary General of the China Interbank Market Dealers Association, explained that at present, the first batch of 36 technology innovation bonds has announced an issuance scale of 21 billion yuan, including 22 technology-based companies including BOE and iFLYTEK, as well as 14 equity investment institutions including Yuanhe Holdings and Luxin Venture Capital.

On the afternoon of May 9, a roadshow and exchange event was held at the Beijing Financial Assets Exchange. Representatives of the first batch of eight companies that issued science and technology innovation bonds in the interbank bond market appeared one by one. This marks the beginning of the issuance of science and technology innovation bonds, and the official launch of the “technology board” of the bond market. Bao Xiangming, Deputy Secretary General of the China Interbank Market Dealers Association, explained that at present, the first batch of 36 technology innovation bonds has announced an issuance scale of 21 billion yuan, including 22 technology-based companies including BOE and iFLYTEK, as well as 14 equity investment institutions including Yuanhe Holdings and Luxin Venture Capital.