The construction of a “technology board” of the bond market has ushered in new progress. Following yesterday's announcement of the innovative launch of science and technology innovation bonds in the interbank market, today, the issuance list of the first batch of science and technology innovation bonds was revealed on the official website of the China Interbank Market Dealers Association. At the time of press release, 27 issuers had been involved, and 2 Shenzhen companies had appeared among them. Among them, Lixun Precision plans to issue 1 billion yuan of science and innovation bonds. The capital raised will be used to optimize the company's debt structure, supplement the company's working capital, and empower the construction of high-end intelligent manufacturing bases and the upgrading of digital manufacturing. Shenzhen Investment Holdings plans to issue a total of 1 billion yuan in science and technology innovation bonds. The funds raised will be earmarked to invest in science and innovation fields such as intelligent manufacturing, high-end equipment, semiconductors and integrated circuits, AI and physical robots, new materials, new energy and intelligent connected vehicles.

Zhitongcaijing · 05/08 10:17
The construction of a “technology board” of the bond market has ushered in new progress. Following yesterday's announcement of the innovative launch of science and technology innovation bonds in the interbank market, today, the issuance list of the first batch of science and technology innovation bonds was revealed on the official website of the China Interbank Market Dealers Association. At the time of press release, 27 issuers had been involved, and 2 Shenzhen companies had appeared among them. Among them, Lixun Precision plans to issue 1 billion yuan of science and innovation bonds. The capital raised will be used to optimize the company's debt structure, supplement the company's working capital, and empower the construction of high-end intelligent manufacturing bases and the upgrading of digital manufacturing. Shenzhen Investment Holdings plans to issue a total of 1 billion yuan in science and technology innovation bonds. The funds raised will be earmarked to invest in science and innovation fields such as intelligent manufacturing, high-end equipment, semiconductors and integrated circuits, AI and physical robots, new materials, new energy and intelligent connected vehicles.