TSMC is about to complete the development of advanced panel-level chip packages, and plans to begin small-batch production around 2027. To meet the demand for more powerful artificial intelligence chips, advanced panel-level chip packages will use square substrates that can accommodate more semiconductors rather than traditional round substrates.

Zhitongcaijing · 3d ago
TSMC is about to complete the development of advanced panel-level chip packages, and plans to begin small-batch production around 2027. To meet the demand for more powerful artificial intelligence chips, advanced panel-level chip packages will use square substrates that can accommodate more semiconductors rather than traditional round substrates.