The Zhitong Finance App learned that on Monday, Micron Technology (MU.US) rose more than 5% to $73.63. According to the news, it is reported that Micron is speeding up the procurement of TC bonding equipment from the South Korean manufacturer Hanmi Semiconductor to support the expansion of the 12Hi HBM3E. According to the data, in the first half of this year, Micron's orders for Korean and American semiconductor TC bonding machines exceeded the scale of 30 to 40 units last year. It is worth noting that currently only Korean-American semiconductor devices can meet 12Hi TC bonding requirements, while Japan's Shinkawa Shinkawa only supports 8HI bonding.

The Zhitong Finance App learned that on Monday, Micron Technology (MU.US) rose more than 5% to $73.63. According to the news, it is reported that Micron is speeding up the procurement of TC bonding equipment from the South Korean manufacturer Hanmi Semiconductor to support the expansion of the 12Hi HBM3E. According to the data, in the first half of this year, Micron's orders for Korean and American semiconductor TC bonding machines exceeded the scale of 30 to 40 units last year. It is worth noting that currently only Korean-American semiconductor devices can meet 12Hi TC bonding requirements, while Japan's Shinkawa Shinkawa only supports 8HI bonding.