Intel announced on November 26 that the US Department of Commerce and Intel have reached an agreement on relevant provisions, and the US Department of Commerce will provide direct funding of up to 7.86 billion US dollars for Intel's commercial semiconductor manufacturing projects in accordance with the “Chip Act.” The funding will support Intel's previously announced plans to advance key semiconductor manufacturing and advanced packaging projects in Arizona, New Mexico, Ohio, and Oregon. Intel also plans to apply for investment tax credits from the US Treasury, which is expected to receive up to 25% of the eligible investment amount of more than $100 billion.

Intel announced on November 26 that the US Department of Commerce and Intel have reached an agreement on relevant provisions, and the US Department of Commerce will provide direct funding of up to 7.86 billion US dollars for Intel's commercial semiconductor manufacturing projects in accordance with the “Chip Act.” The funding will support Intel's previously announced plans to advance key semiconductor manufacturing and advanced packaging projects in Arizona, New Mexico, Ohio, and Oregon. Intel also plans to apply for investment tax credits from the US Treasury, which is expected to receive up to 25% of the eligible investment amount of more than $100 billion.