At the Intel New Quality Productivity Technology Ecosystem Conference held today, Wang Rui, senior vice president of Intel and chairman of Intel China, said that expanding the Chengdu packaging and testing base has two key points: one is to increase the production capacity of server chips, so that the Chengdu packaging test base can cover a wide range of products from clients to server chips, meet a wide range of needs in the Chinese market, and greatly shorten the time to respond to customers and enhance the resilience of the supply chain; the second is to establish a one-stop customer solution center to create a comprehensive platform to promote the digital transformation of enterprises. These two projects will accelerate local industrial chain support and increase and deepen support for Chinese customers.

At the Intel New Quality Productivity Technology Ecosystem Conference held today, Wang Rui, senior vice president of Intel and chairman of Intel China, said that expanding the Chengdu packaging and testing base has two key points: one is to increase the production capacity of server chips, so that the Chengdu packaging test base can cover a wide range of products from clients to server chips, meet a wide range of needs in the Chinese market, and greatly shorten the time to respond to customers and enhance the resilience of the supply chain; the second is to establish a one-stop customer solution center to create a comprehensive platform to promote the digital transformation of enterprises. These two projects will accelerate local industrial chain support and increase and deepen support for Chinese customers.