According to the CITIC Construction Investment Research Report, since the launch of ChatGPT in November 2022, the big model has been rapidly iterated, and hundreds of companies have competed. OpenAI launched GPT-4O in the first half of 2024, marking a new era of expansion from single text processing to multi-modal understanding and generation. At the same time, the commercialization of end-side AI applications has been accelerated, AI phones and AIPC have been released successively, and extended to wearables, smart cars, XR, etc., with a focus on end-side AI. Rapid iteration of AI has brought rapid growth in computing power demand, demand for advanced manufacturing processes and advanced packaging is rising, and related manufacturers are actively expanding production. The localization rate of traditional semiconductors in China is high, but the self-sufficiency of high-end chips is limited, and there is an urgent need for localization, focusing on the manufacture of domestic high-end chips, core equipment materials, EDA software, etc.

According to the CITIC Construction Investment Research Report, since the launch of ChatGPT in November 2022, the big model has been rapidly iterated, and hundreds of companies have competed. OpenAI launched GPT-4O in the first half of 2024, marking a new era of expansion from single text processing to multi-modal understanding and generation. At the same time, the commercialization of end-side AI applications has been accelerated, AI phones and AIPC have been released successively, and extended to wearables, smart cars, XR, etc., with a focus on end-side AI. Rapid iteration of AI has brought rapid growth in computing power demand, demand for advanced manufacturing processes and advanced packaging is rising, and related manufacturers are actively expanding production. The localization rate of traditional semiconductors in China is high, but the self-sufficiency of high-end chips is limited, and there is an urgent need for localization, focusing on the manufacture of domestic high-end chips, core equipment materials, EDA software, etc.