Huahai Chengke (688535.SH) plans to acquire the remaining 70% of Warwick Electronics' shares and resume trading on November 26

According to the Zhitong Finance App, Huahai Chengke (688535.SH) disclosed the restructuring plan. The company plans to purchase 70% of the shares of Hengshuo Warwick Electronics Co., Ltd. (“Warwick Electronics”) held by 13 shareholders including Hangzhou Shuhui and raise supporting capital by issuing shares, convertible corporate bonds, and paying cash. After the transaction is completed, Weifei Weisho will become a wholly-owned subsidiary of the company. Trading of the company's shares will resume with the opening of the market on November 26, 2024 (Tuesday).

The target company, Hengsuo Warwick, is also engaged in R&D, production and sales of semiconductor chip packaging materials. The main products are epoxy encapsulants. Hengshuo Warwick and its predecessor have been deeply involved in the field of semiconductor chip packaging materials for more than 40 years. They later integrated German and Korean technology, had the world-famous brand “Hysol”, and accumulated a number of world-renowned semiconductor customers, such as Nexperia (Nexperia), ST Microelectronics (ST Microelectronics), Infineon (ATX), AVX (AVX), KEMET (KEMET), and Litt Semiconductors (ATX) Littelfuse), Onsemi (Onsemi), Texas Instruments (TI), etc.

After the transaction is completed, the listed company's annual production and sales volume in the semiconductor epoxy encapsulation field is expected to exceed 25,000 tons, steadily taking the leading position in the domestic market and ranking second in the world. At the same time, integrating the R&D advantages accumulated by both parties in advanced packaging, rapidly promoted the development and mass production progress of advanced packaging materials such as granular plasticizer (GMC), bottom filler (MUF), and liquid molding material (LMC), broke the “stuck neck” situation in this field, gradually realized domestic substitution, and extended production and sales bases to South Korea and Malaysia, becoming a world-class semiconductor packaging material company with R&D, production and sales bases at home and abroad.